IEEE Transactions on Components Packaging and Manufacturing

期刊基本信息

期刊名称：IEEE Transactions on Components Packaging and Manufacturing

出版国家或地区：UNITED STATES

是否OA：No

期刊ISSN：2156-3950

期刊官方网站：https://www.ieee.org/membership-catalog/productdetail/showProductDetailPage.html?product=PER240-PRT

涉及的研究方向：ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL

出版年份：2011

期刊数据表：

IEEE Transactions on Components Packaging and Manufacturing英文简介：

IEEE Transactions on Components, Packaging, and Manufacturing covers the following content areas: modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.Membership in IEEE's technical societies provides access to top quality publications such as this one either as a member benefit or via discounted subscriptions. The electronic version of this journal is part of the CPMT Society membership, but all media types are also offered for purchase.

IEEE Transactions on Components Packaging and Manufacturing中文简介：

IEEE关于组件、封装和制造的交易涵盖了以下内容领域：建模、设计、构建模块、技术基础设施和支持电子、光子和MEMS封装的分析，以及无源组件、电气触点和连接器、热管理和设备可靠性方面的新发展；以及电子零件和总成的制造，具有广泛的设计、工厂建模、装配方法、质量、产品鲁棒性和环境设计。IEEE技术协会的会员资格提供了访问顶级出版物的机会，如作为会员利益或通过折扣订阅。该杂志的电子版是CPMT协会会员的一部分，但也提供所有媒体类型的购买。

IEEE Transactions on Components Packaging and Manufacturing在线问答：