JOURNAL OF ELECTRONIC PACKAGING

期刊基本信息

期刊名称：JOURNAL OF ELECTRONIC PACKAGING

出版国家或地区：UNITED STATES

是否OA：No

期刊ISSN：1043-7398

期刊官方网站：http://electronicpackaging.asmedigitalcollection.asme.org/journal.aspx

期刊投稿网址：https://journaltool.asme.org/home/JournalDescriptions.cfm?JournalID=5&Journal=EP

通讯方式：ASME-AMER SOC MECHANICAL ENG, THREE PARK AVE, NEW YORK, USA, NY, 10016-5990

涉及的研究方向：工程技术-工程：电子与电气

出版周期：Quarterly

期刊数据表：

JOURNAL OF ELECTRONIC PACKAGING英文简介：

The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.

JOURNAL OF ELECTRONIC PACKAGING中文简介：

电子包装杂志发表论文，使用实验和理论(分析和计算机辅助)的方法、方法和技术来解决和解决在电子和光子学组件、设备和系统的分析、设计、制造、测试和操作中遇到的各种机械、材料和可靠性问题。

历年影响因子

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